IBM’s 0.7nm chip stacks transistors in two layers, nearly 100B in new density leap
A nearly 100 billion-transistor design plus two-layer vertical stacking could reset expectations for how fast silicon gets denser.
By Yousef Al-Zahrani·· 3 min
3 briefings · “density”
A nearly 100 billion-transistor design plus two-layer vertical stacking could reset expectations for how fast silicon gets denser.
NASA’s TESS spots a matched pair of “super puffy” giants, raising new questions for exoplanet models.
A new vertically stacked chip architecture could deliver up to 50% more work and 70% better energy efficiency in data centers.